Zero optical dead shadows.
Eliminate defect blind spots behind tall components with our coplanar hexagonal sensor array. We deliver absolute optical certainty and micrometer-level precision at full line-rate throughput.
Definite optical certainty.
100%
inspection coverage
0%
optical dead shadows
120
boards per hour throughput
Engineered for extreme density.
Hexagonal sensor array
Micrometer precision
Line-rate speed
Six coplanar optical sensors capture every solder joint from multiple angles simultaneously, completely bypassing physical component height barriers.
Identify sub-micron bridge defects, voiding, and dry joints with high-resolution telecentric lenses calibrated for high-density assemblies.
Process complex multi-layered boards without bottlenecking your production flow. Real-time GPU-accelerated image analysis maintains maximum line-rate throughput.
Secure absolute optical certainty.
Connect directly with our Munich-based hardware engineering team. We provide custom optical path simulations and system integration specifications for your specific assembly line configurations.