Absolute optical certainty.
Our systems deploy a proprietary hexagonal sensor array to completely eliminate optical dead shadows on high-density SMT lines, maintaining full throughput speed.
0.6µm
Max Resolution
100%
Shadow Elimination
120cm²/s
Throughput Rate
Precision engineered platforms.
Our specialized in-line platforms integrate directly into existing high-speed SMT lines, offering sub-micron resolution options that cater to advanced semiconductor packaging.
Model X6 Platform
Model X8 Platform
Model X10 Platform
High-speed in-line AOI engineered for dense SMT lines. Features our signature hexagonal sensor array to eliminate blind spots at line-rate throughput.
Advanced sub-micron resolution system designed for semiconductor packaging. Delivers micrometer-level precision for sub-100-micron component inspection.
Heavy industrial platform built on a solid granite base. Ensures maximum thermal stability and calibration longevity for high-volume manufacturing environments.
Granite Base
Thermal Stability
120 cm²/s
Throughput Rate
0.6 µm
Max Resolution
Hardware integration.
See the physical machine footprints, robust granite bases, and multi-angle sensor arrays that ensure thermal stability and absolute calibration longevity.
Zero shadow inspection.
Partner with our engineering team to integrate OmniHex AOI platforms directly into your existing production lines for immediate shadow-elimination.