

Hexagonal Sensor Array
Eliminating optical dead shadows
Traditional inspection misses defects hidden behind tall components. Our multi-axial hexagonal array captures every solder joint from six coplanar angles simultaneously.
Core Technology
Zero-blind-spot inspection capability
Coplanar Mapping
3D Reconstruction
Line-Rate Throughput
Six sensors capture simultaneous 60-degree offset views, mapping the board topography in a single pass.
Advanced volumetric algorithms combine multi-angle data to build a complete topological model of every joint.
Parallel image processing eliminates the cycle-time penalty of traditional multi-pass inspection methods.




Technical Specifications
Precision optical architecture
Optical Array Specs
6
Coplanar Sensors
60°
Angular Offset
1.2 µm
Lateral Resolution
Throughput Specs
100%
Inspection Coverage
0 ms
Added Cycle Time
0.01%
False-Call Rate
Ready for absolute optical certainty?
Integrate our hexagonal sensor technology into your existing SMT lines to eliminate false calls and secure 100% defect detection.
