

Eliminating optical dead shadows
Traditional inspection misses defects hidden behind tall components. Our multi-axial hexagonal array captures every solder joint from six coplanar angles simultaneously.
Zero-blind-spot inspection capability
Coplanar Mapping
3D Reconstruction
Line-Rate Throughput
Six sensors capture simultaneous 60-degree offset views, mapping the board topography in a single pass.
Advanced volumetric algorithms combine multi-angle data to build a complete topological model of every joint.
Parallel image processing eliminates the cycle-time penalty of traditional multi-pass inspection methods.




Precision optical architecture
Optical Array Specs
6
Coplanar Sensors
60°
Angular Offset
1.2 µm
Lateral Resolution
Throughput Specs
100%
Inspection Coverage
0 ms
Added Cycle Time
0.01%
False-Call Rate
Ready for absolute optical certainty?
Integrate our technology into your existing SMT lines to eliminate false calls and secure 100% defect detection. Protected by following R.O.C. patents
[GRANTED] Optical axis adjustment method for off-axis elliptical mirrors | 112126214 (2023)
[GRANTED] Far and near dual optometric generator | 111136892 (2022)
[GRANTED] Conformal sensors with flame retardant properties | 109215834 (2020)
[GRANTED] Jitter recognition method based on transmitting light and its system | 108129443 (2019)
[GRANTED] Substrate material for penetration | 104111569 (2015)
[GRANTED] Jitter identification methods and their systems (utility model) | 108129442 (2019)
[PENDING] Omnidirectional Optical Side-View Integrated Inspection Device and Method | — (2026)
