Eliminate Optical Dead Shadows
Submit your ODB++ or Gerber layout files directly to our Munich-based optical applications team. We will generate a comprehensive shadow-analysis report and machine compatibility specification within forty-eight hours.
Frequently Asked Questions
Review our primary hardware integration parameters, CAD file requirements, and custom testing protocols to prepare your assembly specifications for our engineering team.
What file formats do you accept?
Can we run physical test boards?
We primarily accept standard ODB++, Gerber RS-274X, and IPC-2581 layout formats. Our application engineers utilize these files to map exact component coordinates and simulate optical paths.
Yes. You can ship physical sample boards directly to our Munich or Shanghai demo centers. We perform live inspection runs and deliver detailed micrometer-level defect mapping reports.
How does the hexagonal array work?
What is the maximum component height?
Six coplanar sensors inspect the board from sixty-degree radial offsets simultaneously. This synchronized multi-axial approach ensures light paths reach behind tall capacitors without reducing line-rate throughput.
Our standard multi-angle optical heads inspect assemblies with components up to twenty-five millimeters in height, completely eliminating shadows on adjacent micro-solder joints.